Product overview
- Product number
- 522-AG11D
- Manufacturer
- TE Connectivity AMP Connectors
- Catalog
- Sockets for ICs, Transistors
- product description
- CONN IC DIP SOCKET 22POS GOLD
Documents and media
- Datasheets
- 522-AG11D
Product Details
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin-Lead
- Contact Finish Thickness - Mating :
- 25.0µin (0.63µm)
- Contact Finish Thickness - Post :
- 25.0µin (0.63µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass, Copper
- Features :
- Closed Frame
- Housing Material :
- Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 22 (2 x 11)
- Operating Temperature :
- -55°C ~ 125°C
- Part Status :
- Active
- Termination :
- Solder
product description
CONN IC DIP SOCKET 22POS GOLD
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